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AT93C46 Ordering Information (1)
AT93C46-10PU-2.7
Ordering Code
(2)
AT93C46-10PU-1.8 (2)
AT93C46-10SU-2.7 (2)
AT93C46-10SU-1.8 (2)
AT93C46W-10SU-2.7 (2)
AT93C46W-10SU-1.8 (2)
AT93C46-10TU-2.7 (2)
AT93C46-10TU-1.8 (2)
AT93C46Y1-10YU-1.8 (2) (Not recommended for new
designs)
AT93C46Y6-10YH-1.8 (3)
AT93C46U3-10UU-1.8 (2)
AT93C46-W1.8-11 (4)
Package
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8Y1
8Y6
8U3-1
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
( ? 40 ° C to 85 ° C)
Industrial
( ? 40 ° C to 85 ° C)
Notes:
8P3
8S1
8S2
8A2
8U3-1
8Y1
8Y6
? 2.7
? 1.8
R
10
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the Table 3 on page 3 and Table 4
on page 4. Not recommended for new design. Please refer to AT93C46D datasheet.
2. “U” designates Green Package and RoHS compliant.
3. “H” designates Green Package and RoHS compliant, with NiPdAu Lead finish
4. Available in waffle pack and wafer form, order as SL788 for inkless wafer form. Bumped die available upon request.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-ball, Die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50mm Pitch, Ultra-Thin Mini-MAO, Dual No Lead Package. (DFN), (MLP
2x3mm)
Options
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
Rotated Pinout
AT93C46
5140B–SEEPR–2/07
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相关代理商/技术参数
AT93C56
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RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8
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AT93C56-10PC-2.5
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